Thermal-Safe Dynamic Test Scheduling Method Using On-Chip Temperature Sensors for 3D MPSoCs

System test and online test techniques are aggressively being used in today’s SoCs for improved test quality and reliability (e.g., aging/soft-error robustness). With gaining popularity of vertical integration such as 2.5D and 3D, in the semiconductor industry, ensuring thermal safety of SoCs during these test modes poses a challenge. In this paper, we propose a dynamic test scheduling mechanism for system tests and/or online test that uses dynamic feedback from on-chip thermal sensors to control temperature during shift (or scan) and capture, thereby ensuring thermal-safe conditions while applying the test patterns. The proposed technique is a closed loop test application scheme that eliminates the need for separate thermal simulation of test patterns at design stage. The technique also enables granular field-level configuration of thermal limits, so that different units across multiple cores are subjected to customized thermal profiles. Results from implementation of the proposed schemes on a 4-layer, 16-core, 12.8 million gates, OpenSparc S1 processor subsystem are presented.